Langen/Germany, 18. January, 2018 --- Socionext Inc., a leader in state-of-the art system-on-chip technology, will feature its high performance SoC designs, serial transceiver technologies and advanced packaging solutions at the annual DesignCon conference, Jan. 31 – Feb. 1 at the Santa Clara Convention Center, Booth 1239.
At DesignCon, Socionext will showcase ultra energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers and demonstrate solutions that are optimized to help companies cost-effectively meet today’s performance, functionality and time-to-market package design requirements.
As Cloud Service Providers adopt 56Gb/s serial connectivity to accommodate the rapid growth of traffic in their data centers, they require 56+Gb/s signaling for chip-to-module, chip-to-chip, and board-to-board communications. Socionext offers proven energy-saving SerDes transceivers operating from 1 to 56Gb/s, with 112+ Gb/s solutions available later in 2018.
